3D Glass Cover Panel LDI Laser Direct Image Exposure Machine For Vehicle Glass
In the world of PCB Manufacturing, it is important to stay as up-to-date as possible with industry trends. This is because, circuit boards are constantly evolving and getting more complex, due to miniaturization trends in the electronics industry. These changes have caused the traditional imaging process for HDI PCBs to provide inadequate results.
In response to new electronics tendencies, the PCB manufacturing industry has come up with a new imaging technique known as Laser Direct Imaging. Below you will find an introductory guide to this process.
Advanced Automation Line for 3D Cover Glass
This automation line is used to produce BM patterning process on 3D glass for smart phone;
3D raw glass material input by fully equipped automatic loading machine, followed by plasma cleaner, automatic spraying machine, tunnel oven, DLP exposure machine, developing and washing machine, final goods output by unloading machine;
Up to 30um resolution, over 95% of yield, thinning BM layer that easier for assembly, higher pattern quality and lower cost of ownership for customers;
| Specifications/model | GD-600 |
| Dimension ( mm )(can be customized) | 3850mm*1350mm*1800mm |
| weight | 3000KG |
| Maximum Power | 4KW |
| Maximum Exposure Area (can be customized) | 1500mm*600mm*200mm |
| Laser source | 375nm±10nm,405nm±10nm |
| Laser output power | 375-12w(±3%),405-5W(±3%) |
| Laser transmission method | optical fiber |
| Lens magnification | 1.95 times/3.95 times |
| Resolution | 12700dpi |
| Spot size | 40mm*7mm |
| Hardware Repeatability | ±5um |
| Photosensitive Material | Photoresist |
| Input Document Format | Gerber274x |
*Specifications subject to change without notice
About US
GIS Intelligent Inc., subsidiary corporation of GIS Tech Inc., focusing on advanced solution for Lithium battery fabrication and 3D cover glass patterning. GIS Tech Inc. was established by founders from U.S in 2015, Suzhou China, developing Digital Lighting Processing (DLP) specially for different industry patterning solution needs, which enable MEMS/Glass /PCB/Screen printing manufacturers to achieve the best imaging results with the highest throughput.
We are the leader in automation solution for 3D cover glass in the world, which was used to produce high quality BM patterning on large curvature glass by DLP photolitho. Our DLP systems powered by Dr. Takeda, together with GIS’s semiconductor laser diodes technologies to achieve enhanced Depth-of-Focus for 3D topography changes, as well as patterning uniformity.
The core team of GIS Tech come from the top 500 international companies from the United States. Based on over 20 years experience of semiconductor technology, automation and materials teams, we fully understand and master the industry‘s development trend and cutting-edge technology. Our expertise in transferring patterns on cover glass materials at high curvature level and irregular shaped enables customers to transform possibilities into reality, especially for 3C smart electronics and automobile cover glass.
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400nm To 410nm Laser Direct Imaging 133LPI Decal Heat Transfer Images
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